Characteristics
- The resin will keep the circuits flat during the entire processing
- At the end of the process, the films can easily be peeled off with no residues left
- 3 different hardnesses and adhesion strengths
- No time consuming and expensive design and tooling
- High productivity (circuits or panels can be "rolled" into contact)
- Low thermal mass
- Due to ease of use and re-usability, very cost efficient
- 300mm x 500mm base size of carriers (before singulation)
- In case of components mounted on back side, holes are made on the carrier
- Maximum temperature is 260C
- Easy cleaning
- Number of times used can be up to 3.000 (lower in case of 260C temperature excursions)

Applications:
FPC, COF, TCP, wirebond, soldering, handling ....
- wherever there is a need for fixing flex or thin PWB's during processing:
- ACF, SMT, solder paste printing, encapsulation, underfill dispensing, reflow and curing